BGA Rework Services

P

rocess Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA devices, and continues to be a pioneer in the challenging field of BGA rework.

Because of our strong reputation and long history of resolving rework challenges, PSI is often asked to handle problematic materials and challenging applications, or to repair work done by others. In particular, PSI has experience overcoming severe deflection in circuit boards, part warpage, heavy copper ground planes, massive (>2500 i/o) BGAs, flexible circuit boards, interposers, and more.

Watch two large BGAs reflow in real time

Watch in real time as two large BGAs (approximately 1500 spheres) are reflowed onto assemblies.  As the parts approach reflow temperature, the solder spheres will begin to shine and sparkle, as flux agents activate and burn away oxides. (In this case, that's 217-220 deg C for SAC305 alloy.) As these parts near the end of the reflow profile, watch as the near edge rises up, then dramatically drops as the last of the solder balls melt and collapse. While it's common for BGAs to warp during a reflow profile, the dramatic rise and fall of these BGAs is not typical. Remarkably, these particular placements were both successful, with no open or bridged solder joints underneath.

Our ARTStation convection air rework systems were conceptualized and designed internally, and manufactured exclusively for PSI. With bottomside heater capable of delievering 8kW power, flexible fixturing options, and an assortment of custom nozzles, these systems can handle virtually any size assembly, from large test platform boards to tiny mobile electronics. They are part of what allows PSI to remain agile in exceeding client expectations.

 

 BGA Rework Services