Is reballing outside your sphere? Don't stress - call the experts at PSI! With over 20 years experience reballing BGA devices of every size, pitch, and package style, PSI delivers consistent quality, low cost, and top notch service. PSI clients become very attached!
PSI knows solder, our staff has over 50 years experience reworking & reballing array devices. Specialty rework equipment conceptualized by, and manufactured for PSI, allows quick & accurate profiling of all assemblies up to 24" x 24" and 0.25" thick.
PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles.
Just say "no" to scrap. And re-spins. And missed deadlines. Forgot something on that prototype board? Let PSI's experienced team accomplish your ECO modifications, while you avoid delays, respins and scrapped assemblies.
Whether you're building high reliability assemblies for military or aerospace, or just need to provision older Sn-Pb inventory for RoHS compliant applications, you can rely on PSI for BGA alloy conversions.
Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices.
PSI offers real-time, off-axis X-ray using two X-Tek Revolution X-ray stations, specializing in the inspection of PCBAs and array devices for failure analysis, validation, or screening. Five motion axes and 75 degree oblique viewing allows operators to visualize the most demanding defects.
Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.
Our dye penetrant test is a reliable method for detecting open solder joints under bottom-terminated SMT components. failure analysis and process validation.
PSI uses scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) capability easily identify microscopic features and elemental composition of your materials.
IC Analysis is the preferred method for identifying surface contaminants on printed circuit assemblies. If you are concerned about board cleanliness, we can help!
PSI has pioneered a comprehensive counterfeit detection and screening process that combines our industry expertise in SMT failure analysis with our onsite, full-service SMT laboratory to help our clients keep counterfeit parts out of your supply chain.
Our analytical services laboratory is dedicated to helping clients in the electronics circuit assembly and semiconductor industries. Our extensive analytical capabilities allow us to promptly identify issues and develop solutions that enable our customers to keep their projects on track.
PSI offers classes that prepare technicians, quality managers, and engineers for excellence in SMT production.
Attendees of PSI's X-ray inspection training class will learn to use off-axis X-ray to inspect circuit assemblies and components, with a focus on array devices. Graduates are eligible to use our facilities for unassisted X-ray at reduced rates.
SMT MasterThis course was designed to provide in-depth practical process understanding to those individuals interested in ensuring quality in electronic assemblies, for improved yields and resource utilization. For Quality managers, SMT engineers, and line technicians.
SMT production environments offer a host of challenges. PSI consultants have extensive backgrounds in DFx, circuit assembly processes, metallurgy, and failure analysis. Put us to work for you.