Process Sciences wants to assist you with your SMT challenges, especially Root Cause Failure Analysis and SMT Process Validation. See our in-house services below, and contact our sales team to discuss your project or obtain a price quote.
PSI offers real-time, off-axis X-ray using two X-Tek Revolution X-ray stations, specializing in the inspection of PCBAs and array devices for failure analysis, validation, or screening. Five motion axes and 75 degree oblique viewing allows operators to visualize the most demanding defects.
Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.
Our dye penetrant test is a reliable method for detecting open solder joints under bottom-terminated SMT components. failure analysis and process validation.
PSI uses scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) capability easily identify microscopic features and elemental composition of your materials.
IC Analysis is the preferred method for identifying surface contaminants on printed circuit assemblies. If you are concerned about board cleanliness, we can help!
PSI has pioneered a comprehensive counterfeit detection and screening process that combines our industry expertise in SMT failure analysis with our onsite, full-service SMT laboratory to help our clients keep counterfeit parts out of your supply chain.
Our analytical services laboratory is dedicated to helping clients in the electronics circuit assembly and semiconductor industries. Our extensive analytical capabilities allow us to promptly identify issues and develop solutions that enable our customers to keep their projects on track.
Our lab is equipped to answer a range of SMT analysis challenges, such as root cause failure analysis, SMT process validation, material qualification, material analysis, and more.