PSI knows solder, our staff has over 50 years experience reworking & reballing array devices. Specialty rework equipment conceptualized by, and manufactured for PSI, allows quick & accurate profiling of all assemblies up to 24" x 24" and 0.25" thick.
Rework Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices.

Is reballing outside your sphere? Don't stress - call the experts at PSI! With over 20 years experience reballing BGA devices of every size, pitch, and package style, PSI delivers consistent quality, low cost, and top notch service. PSI clients become very attached!

PSI has over 20 years experience restoring gull wing leads on QFP and SOIC packages, as well as myriad surface mount connector styles.

Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.

Whether you're building high reliability assemblies for military or aerospace, or just need to provision older Sn-Pb inventory for RoHS compliant applications, you can rely on PSI for BGA alloy conversions.
Just say "no" to scrap. And re-spins. And missed deadlines. Forgot something on that prototype board? Let PSI's experienced team accomplish your ECO modifications, while you avoid delays, respins and scrapped assemblies.