
The gallery below contains solder defects, primarily beneath array devices such as BGA and QFN packages. Each image features one or more bridged circuits, due to either process deficiencies or material issues. These X-ray images were captured on an X-Tek Revolution X-ray station at Process Sciences, Inc. in Leander, Texas.
Can you spot the defects?
Resistor under BGA #1
Resistor under BGA #1
Bridging under BGA socket
Bridging under BGA socket
Delamination
Delamination
LGA bridges
LGA bridges
Outgassing (voids)
Outgassing (voids)
Can you find the short?
Can you find the short?
Resistor under BGA #2
Resistor under BGA #2
Deflection
Deflection
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