Solder Defects (Shorts) - Process Sciences Inc

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The gallery below contains solder defects, primarily beneath array devices such as BGA and QFN packages. Each image features one or more bridged circuits, due to either process deficiencies or material issues. These X-ray images were captured on an X-Tek Revolution X-ray station at Process Sciences, Inc. in Leander, Texas.

Bridged solder joints

Can you spot the defects?

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