Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.

Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.