CT X-ray with 3D Volume Reconstruction
eal 3D X-ray with CT volume reconstruction allows 3D visualization and virtual cross sections of circuit assemblies, solder joints, and components. CT X-ray is the best tool for many applications, such as failure analysis investigations, reverse engineering, void analysis and defect visualization. Contact PSI today and see if CT X-ray is the right method for your analysis needs.
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CT X-ray is a powerful tool for 3D Imaging for electronics assemblies, for applications such as:
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Solder inspection of complex features such as interposersors, connectors, and stacked BGAs ("PoP" Package-on-Package)
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Virtual Cross Sections on three axes
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PCBA failure analysis
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Reverse engineering circuit layout
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Visualization of complex designs and obscured elements, such as "in situ" connections
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Verify build quality
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Confirm uniform distribution of underfill, epoxy adhesives, solders
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Watch a simulated flight through a 3D volume reconstruction of the Apple Watch Ultra (released 09/2022). For best viewing experience, we recommend full screen. CT X-ray scan was performed at PSI on a Nikon XTH225 CT X-ray station, and the 3D volume reconstructed using VGStudio Max from Volume Graphics. |
CT X-ray inspection service, 3D X-ray, virtual cross sections





