The C3 ionic cleanliness tester is the only system that allows localized extraction, for spot testing specific locations on your assembly for corrosivity of residues.

Verify plating thickness on PCBs using X-ray Fluorescence, for ENIG, ENIPIG, HASL, Silver, Gold, and other common finishes.

True 3D Computed Tomography (CT) X-ray allows PSI to visualize complex internal features.  Common applications include virtual cross-sections, void characterization, root cause investigations, reverse engineering, and more.

Our analytical services laboratory is dedicated to helping clients in the electronics circuit assembly and semiconductor industries. Our extensive analytical capabilities allow us to promptly identify issues and develop solutions that enable our customers to keep their projects on track.

PSI uses scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) capability easily identify microscopic features and elemental composition of your materials.

Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.  

PSI has pioneered a comprehensive counterfeit detection and screening process that leverages our industry expertise in SMT failure analysis to help our clients keep counterfeit parts out of your supply chain.

PSI offers real-time, off-axis X-ray with three 160kV Nikon X-ray stations, perfect for inspecting PCBAs and array devices for failure analysis, validation, or screening. Five motion axes and 75 degree oblique viewing allows operators to visualize subtle and elusive defects.

IC Analysis is the preferred method for identifying surface contaminants on printed circuit assemblies. If you are concerned about board cleanliness, we can help!

Our dye penetrant test is a reliable method for detecting open solder joints under bottom-terminated SMT components.  failure analysis and process validation.