XRF PLATING THICKNESS MEASUREMENTS

urface finishes of PCBs are a critical element of properly soldered assemblies.  X-ray Fluorescence systems are a tool that can verify that PCB platings conform to your specifications. PSI uses a Bowman L Series XRF System to analyze circuit assembly surface finish with exceptional accuracy for all types of plated solder surfaces, including ENIG, ENIPIG, HASL, immersion silver, immersion tin, and hard gold.

How It Works

X-ray fluorescence systems work by focusing an X-ray beam on the area of interest. Sensitive detectors read the unique energy signatures emitted by the target spot, from the coatings and the underlying substrate, and software precisely calculates both the thickness and constituent elements of each layer. All Bowman XRF systems use the advanced solid state detector technology of a Silicon Drift Detector. Plating composition and thickness analysis for electronic components and connectors, including analysis of PCB finishes, e.g. gold and palladium alloy coatings of ≤ 0.1μm, and nickel coatings.

For help with your investigation, contact the solder experts at Process Sciences.

XRF | Plating Thickness | ENIG | ENIPIG | Immersion Silver | Hard Gold | HASL | Immersion Tin