Process Sciences, Inc

 

The Solder Experts!
Assembly Rework & Laboratory Services

Circuit Assembly Rework & Repair

BGA rework
Many contract manufacturers and design teams rely on Process Sciences to service, modify, & repair their circuit assemblies and array…

SMT Process Consulting

SMT Process Consulting
SMT production environments offer a host of challenges. PSI consultants have extensive backgrounds in DFx, circuit assembly processes,…

Component Reclaim Services

Scrap is an unavoidable reality in electronics manufacturing, but there is still value in many of those BGA devices! When you send obsolete and scrap assemblies to PSI for BGA removal and reball, we turn scrap boards into good inventory.
Component Reclaim Services
BGA crack

Microsection | BGA Analysis

Micro-sectioning is an analysis method used by PSI for failure analysis and process validation. Microscopic inspection of the target plane can reveal hidden defects, process indicators, or anomalies.
Microsection | BGA Analysis
AS9100DSMTA MemberITAR registeredIPC Member

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Process Sciences, Inc. 310 S. Brushy St. Leander, TX 78641 | Ph (512) 259-7070

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